21 August 2026

Memory chip makers debate custom HBM4 design responsibilities

• Semiconductor companies are moving toward custom high-bandwidth memory chips, which are specialized memory that moves data faster than standard options.
• The shift requires DRAM makers (memory chip manufacturers), foundries (factories that manufacture chips), and ASIC designers (engineers who design custom chips) to work together in new ways.
• Companies disagree on who bears financial risk when custom chips fail testing or don't work reliably in production.

How it was covered

TLDR AITLDR editorial team

The industry is transitioning toward custom High Bandwidth Memory (HBM4) architectures, requiring unprecedented collaboration among DRAM makers, foundries, and ASIC designers. This shift introduces major challenges around test coverage, advanced packaging integration, and yield-loss liability.